Time dependence of piezoresistance for the conductor-filled polymer composites

Engineering

• Applied Stress 100%
• Compressive Modulus 50%
• Creep 50%
• Creep Behavior 50%
• Filler Particle 50%
• Filler Volume Fraction 50%
• Good Agreement 50%
• Particle Diameter 50%
• Polymer Matrix 50%
• Potential Barrier Height 50%
• Predicted Result 50%

Keyphrases

• Compressive Modulus 20%
• Creep 20%
• Creep Behavior 20%
• Filled Polymer Composites 100%
• Filler Particles 20%
• Filler Volume Fraction 20%
• Inter-particle 20%
• Particle Size 20%
• Piezoresistance 100%
• Polymer Composites 20%
• Polymer Matrix 20%
• Potential Barrier Height 20%
• Time Dependence 100%

Material Science

• Conductor 100%
• Creep 33%
• Creep Property 33%
• Filled Polymer 100%
• Polymer Composite 100%
• Polymer Matrix 33%
• Volume Fraction 33%