Study on cure behavior of a model epoxy system by means of TTT diagram

Ming Zhang; Xue Feng An; Bang Ming Tang; Xiao Su Yi

Study on cure behavior of a model epoxy system by means of TTT diagram

Ming Zhang, Xue Feng An, Bang Ming Tang, Xiao Su Yi

Research output: Journal Publication › Article › peer-review

1 Citation (Scopus)

Abstract

Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper. Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time (t_gel) and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model. The relationship between glass transition temperature (T_g) and cure degree (α) was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of T_g as a function of both time and temperature. Consequently, characteristic temperatures such as T_g0,gelT_g and T_g∞ were determined. Finally, the Time-Temperature-Transition (TTT) diagram was designed based on the data and equations.

Original language	English
Pages (from-to)	57-62
Number of pages	6
Journal	Cailiao Gongcheng/Journal of Materials Engineering
Issue number	5
Publication status	Published - May 2006
Externally published	Yes

Keywords

Cure behavior
Epoxy resin
TTT diagram

ASJC Scopus subject areas

Aerospace Engineering

Cite this

@article{a2338ecac02140dd828e4d5f7361f267,

title = "Study on cure behavior of a model epoxy system by means of TTT diagram",

abstract = "Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper. Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time (tgel) and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model. The relationship between glass transition temperature (Tg) and cure degree (α) was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of Tg as a function of both time and temperature. Consequently, characteristic temperatures such as Tg0,gelTg and Tg∞ were determined. Finally, the Time-Temperature-Transition (TTT) diagram was designed based on the data and equations.",

keywords = "Cure behavior, Epoxy resin, TTT diagram",

author = "Ming Zhang and An, {Xue Feng} and Tang, {Bang Ming} and Yi, {Xiao Su}",

year = "2006",

month = may,

language = "English",

pages = "57--62",

journal = "Cailiao Gongcheng/Journal of Materials Engineering",

issn = "1001-4381",

publisher = "Beijing Institute of Aeronautical Materials (BIAM)",

number = "5",

}

TY - JOUR

T1 - Study on cure behavior of a model epoxy system by means of TTT diagram

AU - Zhang, Ming

AU - An, Xue Feng

AU - Tang, Bang Ming

AU - Yi, Xiao Su

PY - 2006/5

Y1 - 2006/5

N2 - Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper. Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time (tgel) and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model. The relationship between glass transition temperature (Tg) and cure degree (α) was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of Tg as a function of both time and temperature. Consequently, characteristic temperatures such as Tg0,gelTg and Tg∞ were determined. Finally, the Time-Temperature-Transition (TTT) diagram was designed based on the data and equations.

AB - Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper. Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time (tgel) and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model. The relationship between glass transition temperature (Tg) and cure degree (α) was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of Tg as a function of both time and temperature. Consequently, characteristic temperatures such as Tg0,gelTg and Tg∞ were determined. Finally, the Time-Temperature-Transition (TTT) diagram was designed based on the data and equations.

KW - Cure behavior

KW - Epoxy resin

KW - TTT diagram

UR - http://www.scopus.com/inward/record.url?scp=33745180499&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:33745180499

SN - 1001-4381

SP - 57

EP - 62

JO - Cailiao Gongcheng/Journal of Materials Engineering

JF - Cailiao Gongcheng/Journal of Materials Engineering

IS - 5

ER -

Study on cure behavior of a model epoxy system by means of TTT diagram

Abstract

Keywords

ASJC Scopus subject areas

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