Curing shrinkage and process parameter optimization of epoxy resin based on FBG strain monitoring

Xueqin Li, Gang Liu, Zilong Zhang, Shuangying Ji, Xiaosu Yi

Research output: Journal PublicationArticlepeer-review

10 Citations (Scopus)


Temperature and strain in a representative liquid molding epoxy resin were in-situ monitored by Fiber Bragg Grating (FBG) sensors throughout different curing processes and post-curing processes. Curing shrinkage regularity of the resin in different processes was derived from its linear volume variation transformed from the strain evolution in resin. Process parameters of experiential curing and post-curing processes were validated and optimized based on the curing shrinkage. The results show that conversion degree and glass transition temperature of the liquid moldingresin cured at 80℃ are 90% and 85℃ respectively, which are higher than resin cured at 75℃. However, total curing shrinkage of the resin cured at 80℃ is only 5% higher than cured at 75℃. The strain in resin becomes constant after 180 min in isothermal procedure of 120℃ post-curing, which means the resin is cured completely. There is no need to extend the post-curing time.

Original languageEnglish
Pages (from-to)2151-2157
Number of pages7
JournalFuhe Cailiao Xuebao/Acta Materiae Compositae Sinica
Issue number10
Publication statusPublished - 1 Oct 2016
Externally publishedYes


  • Conversion degree
  • Curing shrinkage
  • Epoxy resin
  • Fiber Bragg grating
  • Glass transition temperature
  • Strain monitoring

ASJC Scopus subject areas

  • Ceramics and Composites
  • General Chemistry
  • Condensed Matter Physics
  • Mechanics of Materials


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