Cure kinetics and TTT-diagram of a bicomponent high performance epoxy resin for advanced composites

Ming Zhang, Xuefeng An, Bangming Tang, Xiaosu Yi

Research output: Journal PublicationArticlepeer-review

18 Citations (Scopus)


The cure kinetics of a bicomponent high performance epoxy resin was studied by dynamic DSC analysis, and the parameters of the cure reaction were obtained to establish a phenomenological model. The relationship between glass transition temperature (Tg) and cure degree (α) was analyzed with an isothermal plus dynamic DSC method based on DiBenedetto equation, and a mathematical description of Tg as a function of both time arid temperature was suggested. Round disk compression mode DMA was employed to study the gelation at different temperatures, and the relationship between gel-time and temperature was obtained. The conversion at gelation turned out to be αgel=0.4539, while the temperature at which vitrification line and gelation line transected was found to be Tg, gel=70.18°C. The time-temperature-transition (TTT) diagram was plotted based on the works above, which served as a tool for process optimization in advanced composites manufacture.

Original languageEnglish
Pages (from-to)17-25
Number of pages9
JournalFuhe Cailiao Xuebao/Acta Materiae Compositae Sinica
Issue number1
Publication statusPublished - Feb 2006
Externally publishedYes


  • Cure kinetic
  • Epoxy resin
  • Gelation
  • TTT diagram

ASJC Scopus subject areas

  • Ceramics and Composites
  • General Chemistry
  • Condensed Matter Physics
  • Mechanics of Materials


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