Analytical modeling of ground surface topography in monocrystalline silicon grinding considering the ductile-regime effect

Keyphrases

• Analytical Model 50%
• Analytical Modeling 100%
• Brittle Materials 50%
• Brittle Mode 50%
• Ductile Mode 50%
• Ductile Regime 100%
• Fracture Surface 50%
• Grinding Process 100%
• Ground Surface Topography 100%
• Industrial Silicon 50%
• Interaction Mode 50%
• Machined Surface 50%
• Monocrystalline Silicon 100%
• Silicon Surface 50%
• Validation Experiment 50%
• Waviness 50%
• Zone Diameter 50%

Engineering

• Analytical Model 20%
• Brittle Material 20%
• Ductile Mode 20%
• Grinding (Machining) 100%
• Ground Surface 100%
• Machined Surface 20%
• Monocrystalline Silicon 100%
• Silicon Surface 20%
• Surface Topography 100%