TY - GEN
T1 - Tailoring of thermal transition temperature and toughening of shape memory epoxy polymer
AU - Deng, Hua
AU - Gao, Junpeng
AU - An, Xuefeng
AU - Yi, Xiaosu
N1 - Copyright:
Copyright 2012 Elsevier B.V., All rights reserved.
PY - 2012
Y1 - 2012
N2 - Shape memory epoxy polymer (SMEP-1) was modified by introducing flexible epoxy into existing resin system. The thermal transition temperature (Ttrans) of shape memory polymer was tailored from 100°C to 76°C with the increase of the weight fraction of the flexible epoxy. The toughness of the polymer was also measured at the same time. The results show that the toughness of the polymer was improved especially at ultralow temperature. The addition of the flexible epoxy didn't affect the excellent shape memory properties of the polymers.
AB - Shape memory epoxy polymer (SMEP-1) was modified by introducing flexible epoxy into existing resin system. The thermal transition temperature (Ttrans) of shape memory polymer was tailored from 100°C to 76°C with the increase of the weight fraction of the flexible epoxy. The toughness of the polymer was also measured at the same time. The results show that the toughness of the polymer was improved especially at ultralow temperature. The addition of the flexible epoxy didn't affect the excellent shape memory properties of the polymers.
KW - Shape memory epoxy polymer
KW - Thermal transition temperature
KW - Toughness
UR - http://www.scopus.com/inward/record.url?scp=84869853926&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMM.182-183.93
DO - 10.4028/www.scientific.net/AMM.182-183.93
M3 - Conference contribution
AN - SCOPUS:84869853926
SN - 9783037854266
T3 - Applied Mechanics and Materials
SP - 93
EP - 98
BT - Applied Mechanics and Mechatronics Automation
T2 - 2012 International Applied Mechanics, Mechatronics Automation Symposium, IAMMAS 2012
Y2 - 7 September 2012 through 9 September 2012
ER -