Abstract
Effect of the ALD HfO 2 film on the structural and electrical properties of the underlying interfacial SiO 2 layer is discussed. It is shown that the k value of the interfacial layer is increased, which may be caused by the removal of oxygen atom from the oxide region near its interface with the Si substrate. The data indicates that the low temperature chemical oxide may be less stable than thermal oxide with respect to oxygen removal. Chemical oxide interfacial layer exhibits higher density of the fixed charge compared with thermal oxide that correlates to lower mobility observed in the gate stack with the chemical oxide interface.
Original language | English |
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Pages | 141-145 |
Number of pages | 5 |
Publication status | Published - 2005 |
Externally published | Yes |
Event | 207th ECS Meeting - Quebec, Canada Duration: 16 May 2005 → 20 May 2005 |
Conference
Conference | 207th ECS Meeting |
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Country/Territory | Canada |
City | Quebec |
Period | 16/05/05 → 20/05/05 |
ASJC Scopus subject areas
- General Engineering