Abstract
The dynamic rheological behavior of polystyrene filled with low-melting-point (Tm) Sn-Pb was investigated at temperatures below and above the Tm of the alloy, 183°C. In the whole temperature range of interest, there existed a secondary plateau in the plot of the dynamic storage modulus versus frequency (ω) at low ωs, and the influences of alloy content and temperature on the plateau were related to the matter state (liquid or solid) of the alloy. We believe that the secondary plateau observed below the alloy Tm was due to the network-type structure formed by the agglomeration of solid filler particles, whereas the plateau above Tm was due to the deformability and relaxation of the liquid alloy droplets. By analyzing the Cole-Cole diagrams, we suggest that the alloy fillers retarded the relaxation processes for polystyrene melt when the temperature was lower than the Tm. However, there existed two separated relaxation processes when the temperature was higher than the Tm, that is, the high-ω relaxation of the phases and low-ω relaxation of the droplets.
| Original language | English |
|---|---|
| Pages (from-to) | 3166-3172 |
| Number of pages | 7 |
| Journal | Journal of Applied Polymer Science |
| Volume | 86 |
| Issue number | 12 |
| DOIs | |
| Publication status | Published - 13 Dec 2002 |
| Externally published | Yes |
Keywords
- Alloys
- Composites
- Melting point
- Polystyrene
- Rheology
ASJC Scopus subject areas
- General Chemistry
- Surfaces, Coatings and Films
- Polymers and Plastics
- Materials Chemistry