Abstract
T-peel test is used to characteristic the separation processes of resin film from release paper. Load-displacement behavior of some elementary resin films in T-peel test processes used in RFI technology are investigated at various loading rates and test temperatures. The results show that the load-displacement curves of cohesive failure differ much from that of interface failure. It prefers cohesive failure at high temperature, otherwise it tend to interface failure at high loading rate. It is deduced that the available processes for resin film separated from release paper is limited in the temperature range which appears as interface failure at T-peel test.
| Original language | English |
|---|---|
| Pages (from-to) | 43-47 |
| Number of pages | 5 |
| Journal | Cailiao Gongcheng/Journal of Materials Engineering |
| Issue number | 3 |
| Publication status | Published - Mar 2005 |
| Externally published | Yes |
Keywords
- Composite
- Processing range
- Resin film
- Resin film infusion
- Separability
ASJC Scopus subject areas
- Aerospace Engineering