Abstract
Temperature profile and the build-up of strains throughout the curing process were in-suit monitored by fiber Bragg grating (FBG) sensors embedded into an epoxy sample. The volume change of the resin was free due to the experimental set. The coefficients of thermal expansion of full-cured resin in cooling stage were also calculated from FBG's measurement data. The results showed that FBG sensors could detect process-induced strains resulting from the volume change of the resin from the gel point until the end of curing. The coefficients of thermal expansion of full-cured resin in cooling stage determined by FBG sensors are comparable to the result of dilatometry. It is sensitive and reliable to determine curing shrinkage of thermoset resin using FBG sensors.
| Original language | English |
|---|---|
| Pages (from-to) | 73-77 |
| Number of pages | 5 |
| Journal | Cailiao Gongcheng/Journal of Materials Engineering |
| Issue number | 8 |
| Publication status | Published - Aug 2012 |
| Externally published | Yes |
Keywords
- Cure shrinkage
- Epoxy resin
- Fiber Bragg grating
- In-suit monitoring
ASJC Scopus subject areas
- Aerospace Engineering