Stress measurement during crack propagation in metal matrix composites using micro-raman spectroscopy

A. K.M. Asif Iqbal, Yoshio Arai

Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

Abstract

The measurement of stress in the SiC particles during crack propagation was investigated by micro raman spectroscopy. The experiment was carried out in situ in the Raman spectroscopy. Experimental results showed that cracks due to monotonic loading propagated by the debonding of the particle/matrix interface and particle fracture. A high decrease in stress was observed with the interfacial debonding at the interface and with the particle fracture on the particle. Moreover, the critical tensile stresses for particle-matrix interface debonding and particle fracture developed in hybrid MMC were also estimated during the crack propagation.

Original languageEnglish
Title of host publicationECCM 2016 - Proceeding of the 17th European Conference on Composite Materials
PublisherEuropean Conference on Composite Materials, ECCM
ISBN (Electronic)9783000533877
Publication statusPublished - 2016
Externally publishedYes
Event17th European Conference on Composite Materials, ECCM 2016 - Munich, Germany
Duration: 26 Jun 201630 Jun 2016

Publication series

NameECCM 2016 - Proceeding of the 17th European Conference on Composite Materials

Conference

Conference17th European Conference on Composite Materials, ECCM 2016
Country/TerritoryGermany
CityMunich
Period26/06/1630/06/16

Keywords

  • Cast Metal Matrix Composite (MMC)
  • Crack propagation
  • Raman spectroscopy
  • Stress measurement

ASJC Scopus subject areas

  • Ceramics and Composites

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