TY - GEN
T1 - Quality optimization of resilient applications under temperature constraints
AU - Yu, Heng
AU - Ha, Yajun
AU - Wang, Jing
N1 - Publisher Copyright:
© 2017 Association for Computing Machinery.
PY - 2017/5/15
Y1 - 2017/5/15
N2 - Inherent resilience of applications enables the design paradigm of approximate computing that exploits computation in-exactness by trading off output quality for runtime system resources. When executing such quality-scalable applications on multiprocessor embedded systems, it is expected not only to achieve the highest possible output quality, but also to handle the critical thermal challenge spurred by vastly increased chip density. While the rising temperature causes significant quality distortion at runtime, existing thermal-management techniques, such as dynamic frequency scaling, rarely take into account the trade-off possibilities between output quality and thermal budget. In this paper, we explore the application-level quality-scaling features of resilient applications to achieve effective temperature control as well as quality maximization. We propose an efficient iterative pseudo quadratic programming heuristic to decide the optimal frequency and application execution cycles, in order to achieve quality optimization, under temperature, timing, and energy constraints. Our approaches are evaluated using realistic benchmarks with known platform thermal parameters. The proposed methods show a 98.5% quality improvement with temperature violation awareness.
AB - Inherent resilience of applications enables the design paradigm of approximate computing that exploits computation in-exactness by trading off output quality for runtime system resources. When executing such quality-scalable applications on multiprocessor embedded systems, it is expected not only to achieve the highest possible output quality, but also to handle the critical thermal challenge spurred by vastly increased chip density. While the rising temperature causes significant quality distortion at runtime, existing thermal-management techniques, such as dynamic frequency scaling, rarely take into account the trade-off possibilities between output quality and thermal budget. In this paper, we explore the application-level quality-scaling features of resilient applications to achieve effective temperature control as well as quality maximization. We propose an efficient iterative pseudo quadratic programming heuristic to decide the optimal frequency and application execution cycles, in order to achieve quality optimization, under temperature, timing, and energy constraints. Our approaches are evaluated using realistic benchmarks with known platform thermal parameters. The proposed methods show a 98.5% quality improvement with temperature violation awareness.
KW - Dynamic frequency scaling
KW - Execution quality
KW - Real-time computing
KW - Resilient application
KW - Thermal-leakage
UR - http://www.scopus.com/inward/record.url?scp=85027069827&partnerID=8YFLogxK
U2 - 10.1145/3075564.3075577
DO - 10.1145/3075564.3075577
M3 - Conference contribution
AN - SCOPUS:85027069827
T3 - ACM International Conference on Computing Frontiers 2017, CF 2017
SP - 9
EP - 16
BT - ACM International Conference on Computing Frontiers 2017, CF 2017
PB - Association for Computing Machinery, Inc
T2 - 14th ACM International Conference on Computing Frontiers, CF 2017
Y2 - 15 May 2017 through 17 May 2017
ER -