TY - GEN
T1 - Photonic integrated circuits based on novel glass waveguides and devices
AU - Zhang, Yaping
AU - Zhang, Deng
AU - Pan, Weijian
AU - Rowe, Helen
AU - Benson, Trevor
AU - Loni, Armando
AU - Sewell, Phillip
AU - Furniss, David
AU - Seddon, Angela B.
N1 - Copyright:
Copyright 2008 Elsevier B.V., All rights reserved.
PY - 2006
Y1 - 2006
N2 - Novel materials, micro-, nano-scale photonic devices, and 'photonic systems on a chip' have become important focuses for global photonics research and development. This interest is driven by the rapidly growing demand for broader bandwidth in optical communication networks, and higher connection density in the interconnection area, as well as a wider range of application areas in, for example, health care, environment monitoring and security. Taken together, chalcogenide, heavy metal fluoride and fluorotellurite glasses offer transmission from ultraviolet to mid-infrared, high optical non-linearity and the ability to include active dopants, offering the potential for developing optical components with a wide range of functionality. Moreover, using single-mode large cross-section glass-based waveguides as an optical integration platform is an elegant solution for the monolithic integration of optical components, in which the glass-based structures act both as waveguides and as an optical bench for integration. We have previously developed an array of techniques for making photonic integrated circuits and devices based on novel glasses. One is fibre-on-glass (FOG), in which the fibres can be doped with different active dopants and pressed onto a glass substrate with a different composition using low-temperature thermal bonding under mechanical compression. Another is hot-embossing, in which a silicon mould is placed on top of a glass sample, and hot-embossing is carried out by applying heat and pressure. In this paper the development of a fabrication technique that combines the FOG and hot-embossing procedures to good advantage is described. Simulation and experimental results are presented.
AB - Novel materials, micro-, nano-scale photonic devices, and 'photonic systems on a chip' have become important focuses for global photonics research and development. This interest is driven by the rapidly growing demand for broader bandwidth in optical communication networks, and higher connection density in the interconnection area, as well as a wider range of application areas in, for example, health care, environment monitoring and security. Taken together, chalcogenide, heavy metal fluoride and fluorotellurite glasses offer transmission from ultraviolet to mid-infrared, high optical non-linearity and the ability to include active dopants, offering the potential for developing optical components with a wide range of functionality. Moreover, using single-mode large cross-section glass-based waveguides as an optical integration platform is an elegant solution for the monolithic integration of optical components, in which the glass-based structures act both as waveguides and as an optical bench for integration. We have previously developed an array of techniques for making photonic integrated circuits and devices based on novel glasses. One is fibre-on-glass (FOG), in which the fibres can be doped with different active dopants and pressed onto a glass substrate with a different composition using low-temperature thermal bonding under mechanical compression. Another is hot-embossing, in which a silicon mould is placed on top of a glass sample, and hot-embossing is carried out by applying heat and pressure. In this paper the development of a fabrication technique that combines the FOG and hot-embossing procedures to good advantage is described. Simulation and experimental results are presented.
KW - Chalcogenide glasses
KW - Components
KW - Glass-based
KW - Heavy metal fluoride and fluorotellurite glasses
KW - Optical simulations
KW - Photonic integrated circuits
KW - Waveguides
UR - http://www.scopus.com/inward/record.url?scp=33746749487&partnerID=8YFLogxK
U2 - 10.1117/12.660781
DO - 10.1117/12.660781
M3 - Conference contribution
AN - SCOPUS:33746749487
SN - 081946239X
SN - 9780819462398
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Integrated Optics, Silicon Photonics, and Photonic Integrated Circuits
T2 - Integrated Optics, Silicon Photonics, and Photonic Integrated Circuits
Y2 - 3 April 2006 through 5 April 2006
ER -