Development of the surface defect machining method for micro/nano scale material removal processes

Saurav Goel; W. B. Rashid; Amir Mir; S. Zeng; Jining Sun; Xichun Luo

Development of the surface defect machining method for micro/nano scale material removal processes

Saurav Goel, W. B. Rashid, Amir Mir, S. Zeng, Jining Sun, Xichun Luo

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

1 Citation (Scopus)

Abstract

In this paper, a novel method named "surface defect machining" (SDM) which was previously applied to hard turning (HT) processes [1] has been applied to nanometric cutting. Using state-of-the-art tools of molecular dynamics simulation and single point diamond turning (SPDT) experiment, it has been shown that a well controlled SDM process can aid to bridge the gap of turning and polishing processes with respect to attainable machined surface roughness and reduced sub-surface damage.

Original language	English
Title of host publication	Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013
Editors	R. Leach, Paul Shore
Publisher	euspen
Pages	348-351
Number of pages	4
Volume	2
ISBN (Electronic)	9780956679024
Publication status	Published - 2013
Externally published	Yes
Event	13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 - Berlin, Germany Duration: 27 May 2013 → 31 May 2013

Conference

Conference	13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013
Country/Territory	Germany
City	Berlin
Period	27/05/13 → 31/05/13

ASJC Scopus subject areas

Mechanical Engineering
General Materials Science
Environmental Engineering
Industrial and Manufacturing Engineering
Instrumentation

Cite this

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title = "Development of the surface defect machining method for micro/nano scale material removal processes",

abstract = "In this paper, a novel method named {"}surface defect machining{"} (SDM) which was previously applied to hard turning (HT) processes [1] has been applied to nanometric cutting. Using state-of-the-art tools of molecular dynamics simulation and single point diamond turning (SPDT) experiment, it has been shown that a well controlled SDM process can aid to bridge the gap of turning and polishing processes with respect to attainable machined surface roughness and reduced sub-surface damage.",

author = "Saurav Goel and Rashid, {W. B.} and Amir Mir and S. Zeng and Jining Sun and Xichun Luo",

year = "2013",

language = "English",

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booktitle = "Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013",

publisher = "euspen",

note = "13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 ; Conference date: 27-05-2013 Through 31-05-2013",

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Goel, S, Rashid, WB, Mir, A, Zeng, S, Sun, J & Luo, X 2013, Development of the surface defect machining method for micro/nano scale material removal processes. in R Leach & P Shore (eds), Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013. vol. 2, euspen, pp. 348-351, 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013, Berlin, Germany, 27/05/13.

Development of the surface defect machining method for micro/nano scale material removal processes. / Goel, Saurav; Rashid, W. B.; Mir, Amir et al.
Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013. ed. / R. Leach; Paul Shore. Vol. 2 euspen, 2013. p. 348-351.

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Development of the surface defect machining method for micro/nano scale material removal processes

AU - Goel, Saurav

AU - Rashid, W. B.

AU - Mir, Amir

AU - Zeng, S.

AU - Sun, Jining

AU - Luo, Xichun

PY - 2013

Y1 - 2013

N2 - In this paper, a novel method named "surface defect machining" (SDM) which was previously applied to hard turning (HT) processes [1] has been applied to nanometric cutting. Using state-of-the-art tools of molecular dynamics simulation and single point diamond turning (SPDT) experiment, it has been shown that a well controlled SDM process can aid to bridge the gap of turning and polishing processes with respect to attainable machined surface roughness and reduced sub-surface damage.

AB - In this paper, a novel method named "surface defect machining" (SDM) which was previously applied to hard turning (HT) processes [1] has been applied to nanometric cutting. Using state-of-the-art tools of molecular dynamics simulation and single point diamond turning (SPDT) experiment, it has been shown that a well controlled SDM process can aid to bridge the gap of turning and polishing processes with respect to attainable machined surface roughness and reduced sub-surface damage.

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M3 - Conference contribution

AN - SCOPUS:84901465204

VL - 2

SP - 348

EP - 351

BT - Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013

A2 - Leach, R.

A2 - Shore, Paul

PB - euspen

T2 - 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013

Y2 - 27 May 2013 through 31 May 2013

ER -

Development of the surface defect machining method for micro/nano scale material removal processes

Abstract

Conference

ASJC Scopus subject areas

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