Atomistic aspects of ductile responses of cubic silicon carbide during nanometric cutting

Keyphrases

• Abrasive Action 16%
• Brittle Materials 16%
• Ceramic Materials 16%
• Cubic Silicon Carbide 100%
• Cutting Conditions 16%
• Cutting Process 33%
• Diamond Graphitization 16%
• Diamond Tool 33%
• Ductile Regime 16%
• Ductile Response 100%
• Graphene-like 16%
• Growth Rate 16%
• Hard Materials 16%
• Material Properties 16%
• Micro-electro-mechanical Systems 16%
• Molecular Dynamics Simulation 16%
• Nanoelectromechanical Systems 16%
• Nanometric Cutting 100%
• Order-disorder Transition 50%
• Rate Dependence 16%
• Silicon Carbide 100%
• Single-point Diamond Turning 16%
• System Application 16%
• Tool Wear 16%
• Turning Process 16%

Engineering

• Abrasive Action 50%
• Brittle Material 50%
• Computer Simulation 50%
• Cutting Condition 50%
• Diamond 50%
• Diamond Tool 100%
• Diamond Turning 50%
• Graphene 50%
• Graphitization 50%
• Microelectromechanical System 50%
• Nanoelectromechanical System 50%
• Nanoscale 50%
• Order Disorder Transition 100%
• Simulation Result 50%

Material Science

• Brittleness 11%
• Ceramic Material 11%
• Diamond 44%
• Graphene 11%
• Materials Property 11%
• Microelectromechanical System 11%
• Silicon Carbide 100%