Analytical modeling of grinding-induced subsurface damage in monocrystalline silicon

Hao Nan Li, Tian Biao Yu, Li Da Zhu, Wan Shan Wang

Research output: Journal PublicationArticlepeer-review

107 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Analytical modeling of grinding-induced subsurface damage in monocrystalline silicon'. Together they form a unique fingerprint.

Keyphrases

Engineering