Engineering
Grinding (Machining)
100%
Grinding Wheel
28%
Subsurface
18%
Machined Surface
18%
Image Processing
15%
Surface Integrity
14%
Analytical Model
12%
Ultrasonics
11%
Chip Thickness
9%
Surface Topography
9%
Experimental Result
9%
Cutting Force
9%
Grinding Force
8%
Delamination
8%
Polishing Process
8%
Super High
8%
Carbon-Fiber-Reinforced Plastic
8%
Metal Matrix Composite
7%
Feed Rate
7%
Processing Technique
7%
Experimental Investigation
7%
Laser Parameter
6%
Diamond
6%
Element Method
6%
Milling Cutters
6%
Creep
6%
Material Removal Mechanism
6%
Mechanical Grinding
6%
Ground Surface
5%
Cutting Parameter
5%
Cubic Boron Nitride
5%
Brittle Material
5%
Abrasive
5%
Keyphrases
Grinding Process
22%
Grinding Wheel
18%
Subsurface Damage
16%
Analytical Modeling
16%
Optical Glass
13%
Surface Integrity
11%
Abrasive
10%
Abrasive Tools
10%
Grinding Temperature
9%
Machined Surface
9%
Analytical Model
9%
Grinding Force
9%
High-speed Grinding
8%
Material Removal Mechanism
8%
Working Surface
8%
BK7 Glass
8%
Automatic Measurement
8%
Polishing Process
8%
Self-sharpening
8%
Experimental Validation
8%
Delamination
7%
Grinding Zone
7%
Carbon Fiber Reinforced Plastic
7%
Metal Matrix Composites
7%
Image Processing Techniques
7%
Titanium Alloy
7%
Tool Wear
7%
Airflow
7%
Abrasive Air Jet Polishing
6%
Depth of Cut
6%
Wheel Speed
6%
Carbon Fiber
6%
Parameter Optimization
6%
Feed Rate
6%
Grinding Performance
5%
Brittle Materials
5%
Undeformed chip Thickness
5%
Image Processing
5%
Biolubricant
5%
High Performance
5%
