Investigating the Thermal Aging Effect on Hairpin PEEK Insulated Wires through PDIV Measurements

Hadi Naderiallaf, Michele Degano, David Gerada, Chris Gerada

Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

Abstract

- This study evaluates the turn-to-turn winding insulation of inverter-fed hairpin electrical machines after thermal aging. It measures partial discharge inception voltage (PDIV) under 20 kHz PWM excitation with a 15 ns rise time and a 50% duty cycle. Six types of polyetheretherketone (PEEK)-insulated hairpin wires are tested to identify the best candidate for aerospace applications at up to 25,000 feet and with an 800-volt DC bus. PDIV tests are conducted at room temperature and above PEEK's glass transition temperature (Tg). The results show that fresh PEEK-insulated wires are superior to aged ones when PDIV testing is conducted at ground level and room temperature. However, evaluating aging through PDIV testing at reduced air pressure is not ideal, as fresh samples only deliver slightly higher PDIV values than aged ones at both room temperature and above Tg.

Original languageEnglish
Title of host publication2024 10th International Conference on Condition Monitoring and Diagnosis, CMD 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages226-229
Number of pages4
ISBN (Electronic)9788986510225
DOIs
Publication statusPublished - 2024
Event10th International Conference on Condition Monitoring and Diagnosis, CMD 2024 - Gangneung, Korea, Republic of
Duration: 20 Oct 202424 Oct 2024

Publication series

Name2024 10th International Conference on Condition Monitoring and Diagnosis, CMD 2024

Conference

Conference10th International Conference on Condition Monitoring and Diagnosis, CMD 2024
Country/TerritoryKorea, Republic of
CityGangneung
Period20/10/2424/10/24

Keywords

  • accelerated aging
  • aerospace materials
  • hairpin machines
  • inverter-fed machines
  • partial discharge inception voltage
  • partial discharges

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality

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