TY - JOUR
T1 - Integrated motor drives
T2 - State of the art and future trends
AU - Abebe, Robert
AU - Vakil, Gaurang
AU - Calzo, Giovanni Lo
AU - Cox, Thomas
AU - Lambert, Simon
AU - Johnson, Mark
AU - Gerada, Chris
AU - Mecrow, Barrie
PY - 2016/9/1
Y1 - 2016/9/1
N2 - With increased need for high power density, high efficiency and high temperature capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a potential solution. However, close physical integration of the converter and the machine may also lead to an increase in components temperature. This requires careful mechanical, structural and thermal analysis; and design of the IMD system. This study reviews existing IMD technologies and their thermal effects on the IMD system. The effects of the power electronics position on the IMD system and its respective thermal management concepts are also investigated. The challenges faced in designing and manufacturing of an IMD along with the mechanical and structural impacts of close physical integration is also discussed and potential solutions are provided. Potential converter topologies for an IMD like the matrix converter, two-level bridge, three-level neutral point clamped and multiphase full bridge converters are also reviewed. Wide band gap devices like silicon carbide and gallium nitride and their packaging in power modules for IMDs are also discussed. Power modules components and packaging technologies are also presented.
AB - With increased need for high power density, high efficiency and high temperature capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a potential solution. However, close physical integration of the converter and the machine may also lead to an increase in components temperature. This requires careful mechanical, structural and thermal analysis; and design of the IMD system. This study reviews existing IMD technologies and their thermal effects on the IMD system. The effects of the power electronics position on the IMD system and its respective thermal management concepts are also investigated. The challenges faced in designing and manufacturing of an IMD along with the mechanical and structural impacts of close physical integration is also discussed and potential solutions are provided. Potential converter topologies for an IMD like the matrix converter, two-level bridge, three-level neutral point clamped and multiphase full bridge converters are also reviewed. Wide band gap devices like silicon carbide and gallium nitride and their packaging in power modules for IMDs are also discussed. Power modules components and packaging technologies are also presented.
UR - http://www.scopus.com/inward/record.url?scp=84987657459&partnerID=8YFLogxK
U2 - 10.1049/iet-epa.2015.0506
DO - 10.1049/iet-epa.2015.0506
M3 - Review article
AN - SCOPUS:84987657459
SN - 1751-8660
VL - 10
SP - 757
EP - 771
JO - IET Electric Power Applications
JF - IET Electric Power Applications
IS - 8
ER -