Finite element simulation of thermography non-destructive testing for gear inspection

Xin Wang, Kar Weng Ng, Ying Pio Lim, Jong Boon Ooi, Jee Hou Ho, Ching Seong Tan, Anthony Guo

Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

Abstract

Thermography non-destructive inspection is widely used as a non-destructive testing method in a variety of applications. This paper describes the application of finite element method for simulation of thermography inspection in gear inspection. This enables the prediction of its behavior in advance to the experiment. The 3-D gear was modeled and simulated using finite element method. The defects with different dimension and depth gear were simulated. Surface temperature distribution of gear for testing was computed. Distortion of heat distribution signifies the crack appearance since there is a temperature drop in the crack region. The abnormal heat path emphasizes the cracked area. In simulation, three types of materials are chosen. Their material characteristic is high, moderate and low in thermal conductivity respectively. Their thermal conductivity directly influences the heat flow rate on the specimen and time for the heat propagation. The comparisons are made between these kinds of materials to study their behavior on thermography inspection.

Original languageEnglish
Title of host publicationNon-Destructive Testing Conference 2010, NDT 2010
PublisherBritish Institute of Non-Destructive Testing
Pages39-55
Number of pages17
ISBN (Print)9781617827907
Publication statusPublished - 2010
Externally publishedYes
Event49th Annual Conference of the British Institute of Non-Destructive Testing, BINDT 2010 - Cardiff, United Kingdom
Duration: 14 Sept 201016 Sept 2010

Publication series

NameNon-Destructive Testing Conference 2010, NDT 2010

Conference

Conference49th Annual Conference of the British Institute of Non-Destructive Testing, BINDT 2010
Country/TerritoryUnited Kingdom
CityCardiff
Period14/09/1016/09/10

ASJC Scopus subject areas

  • Computational Mechanics
  • Mechanics of Materials
  • Safety, Risk, Reliability and Quality
  • Materials Science (miscellaneous)

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