Development of C. albican Anti-attachment Inkjet 3D Printing Ink, via High Throughput Screening

Ling Xin Yong, Zuoxin Zhou, Cindy Vallières, Yinfeng He, Valentina Cuzzucoli Crucitti, Morgan R. Alexander, Simon Avery, Ricky Wildman, Derek Irvine

Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

Abstract

The fungal pathogen Candida albicans (C. albicans) is particularly problematic for immunocompromised patients and those with medical implants. Introducing Candida-resistant medical devices could potentially reduce mortality rates from such infections. Here, we develop the use of high throughput screening (HTS) methodology that can thoroughly and effectively screen a large number of methacrylate and acrylate monomers for their resistance to attachment by C. albicans. In this work, we demonstrate the method using nine selected methacrylate and acrylate monomers and specifically discuss the method developed for UV-curing based 3D printing (3DP) processes, focusing on inkjet printing. The HTS process considers the viscosity and surface tension of monomers for their printing performance, the resulting mechanical properties of its polymer, resistance to fungal attachment, and polymer toxicity towards C. albicans after inkjet printing. This HTS technique accelerates the evaluation and development of polymers with fungal anti-attachment properties for both medical and 3DP fields. Out of the nine polymers demonstrated, 4-tert-butylcyclohexyl acrylate (TBCHA), 4-tert-butylcyclohexyl methacrylate (TBCHMA) were both new fungal anti-attachment materials that were found to be printable using this methodology.

Original languageEnglish
Title of host publicationComputational and Experimental Simulations in Engineering - Proceedings of ICCES 2024 — International Conference on Computational and Experimental Engineering and Sciences ICCES
EditorsKun Zhou
PublisherSpringer Science and Business Media B.V.
Pages437-452
Number of pages16
ISBN (Print)9783031816727
DOIs
Publication statusPublished - 2025
Event30th International Conference on Computational and Experimental Engineering and Sciences, ICCES 2024 - Singapore, Singapore
Duration: 3 Aug 20246 Aug 2024

Publication series

NameMechanisms and Machine Science
Volume175 MMS
ISSN (Print)2211-0984
ISSN (Electronic)2211-0992

Conference

Conference30th International Conference on Computational and Experimental Engineering and Sciences, ICCES 2024
Country/TerritorySingapore
CitySingapore
Period3/08/246/08/24

Keywords

  • 3D printing
  • Additive manufacturing
  • Biomaterial
  • Biomedical device
  • Fungal anti-attachment

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering

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