Active Vibration Isolation Platforms for Wafer Front Opening Unified Pod Transporting Carts Under Raised Floor Irregularities in Industrial Factories

Chien-Liang Lee, Yung-Tsang Chen, Yen-Po Wang, Lap-Loi Chung, Meng-Chieh Liu, Li-Yen Lu

Research output: Journal PublicationArticlepeer-review

Abstract

This study was conducted to examine the vibration control performance of the active isolation platform (AIP) implemented on the cart table (CT) of a moving front opening unified pod (FOUP) transporting cart to prevent damage to fragile silicon wafers during transportation across different buildings in semiconductor fabs. Additionally, the equation of motion for the proposed AIP–cart system simulated by a full vehicle model under raised floor irregularities was derived. Moreover, the direct output feedback control algorithm was used to determine the optimal feedback gain matrix for calculating the active control forces of the AIP. Furthermore, the dynamic time histories of the proposed model under raised floor irregularities were analyzed by the discrete–time state–space procedure (SSP), and the numerical simulation results revealed that AIP effectively suppressed the bouncing (or vertical) acceleration with a reduction of > 90% at FOUP locations to 2.37 m/s2 (< 9.81 m/s2 or 1.0 g, the bouncing acceleration threshold) to prevent FOUPs (or fragile silicon wafers) from bouncing away from the CT without AIP, causing damages to the wafers via collisions. Moreover, AIP greatly reduced the pitching angular rotation with a reduction of > 65% to prevent the sliding of FOUP-stored wafers from the supporting slots inside FOUPs when the FOUP-transporting cart traversed through a larger bump between the expansion joints. The flexible AIP that demanded less control force (27.08 N) significantly isolated the high-frequency response transmitted from the CT and effectively enhanced its damping ratio to suppress the resonance low-frequency response induced by intermittent perforated floor irregularities or bumps. From a practical point of view, the proposed AIP scheme implemented on CT can be adopted for protecting jumping- or sliding-induced collision damages to wafers (or similar fragile products) transported by carts to reduce huge economic losses in industry.
Original languageEnglish
JournalStructural Control and Health Monitoring
DOIs
Publication statusPublished - 19 Feb 2025

Keywords

  • active isolation platform
  • front opening unifed pod
  • ull vehicle model
  • optimal feedback gain matrix
  • raised foorirregularities
  • vibration contro

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