Active thermal control of a DC/DC GaN-based converter

Pramod Kumar Prasobhu; Vivek Raveendran; Giampaolo Buticchi; Marco Liserre

doi:10.1109/APEC.2017.7930840

Active thermal control of a DC/DC GaN-based converter

Pramod Kumar Prasobhu, Vivek Raveendran, Giampaolo Buticchi, Marco Liserre

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

12 Citations (Scopus)

Abstract

Advanced packaging technologies in Wide band gap devices like GaN avoid wire bonds thereby making the solder joints more susceptible to thermo-mechanical fatigue. To limit the thermal cycling induced failures, an active thermal control scheme using a two step gate driver for a buck converter is presented in this paper. In contrast to the active thermal control techniques employing variation of switching frequency, this method does not alter the converter operation point. A simple temperature control algorithm which actively varies the device losses is proposed. The effectiveness of the control scheme has been validated through experimental results.

Original language	English
Title of host publication	2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1146-1152
Number of pages	7
ISBN (Electronic)	9781509053667
DOIs	https://doi.org/10.1109/APEC.2017.7930840
Publication status	Published - 17 May 2017
Externally published	Yes
Event	32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 - Tampa, United States Duration: 26 Mar 2017 → 30 Mar 2017

Publication series

Name	Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Conference

Conference	32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017
Country/Territory	United States
City	Tampa
Period	26/03/17 → 30/03/17

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/APEC.2017.7930840

Cite this

Prasobhu, P. K., Raveendran, V., Buticchi, G., & Liserre, M. (2017). Active thermal control of a DC/DC GaN-based converter. In 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017 (pp. 1146-1152). Article 7930840 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEC.2017.7930840

Prasobhu, Pramod Kumar ; Raveendran, Vivek ; Buticchi, Giampaolo et al. / Active thermal control of a DC/DC GaN-based converter. 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1146-1152 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC).

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title = "Active thermal control of a DC/DC GaN-based converter",

abstract = "Advanced packaging technologies in Wide band gap devices like GaN avoid wire bonds thereby making the solder joints more susceptible to thermo-mechanical fatigue. To limit the thermal cycling induced failures, an active thermal control scheme using a two step gate driver for a buck converter is presented in this paper. In contrast to the active thermal control techniques employing variation of switching frequency, this method does not alter the converter operation point. A simple temperature control algorithm which actively varies the device losses is proposed. The effectiveness of the control scheme has been validated through experimental results.",

author = "Prasobhu, {Pramod Kumar} and Vivek Raveendran and Giampaolo Buticchi and Marco Liserre",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 ; Conference date: 26-03-2017 Through 30-03-2017",

year = "2017",

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doi = "10.1109/APEC.2017.7930840",

language = "English",

series = "Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC",

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Prasobhu, PK, Raveendran, V, Buticchi, G & Liserre, M 2017, Active thermal control of a DC/DC GaN-based converter. in 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017., 7930840, Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, Institute of Electrical and Electronics Engineers Inc., pp. 1146-1152, 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017, Tampa, United States, 26/03/17. https://doi.org/10.1109/APEC.2017.7930840

Active thermal control of a DC/DC GaN-based converter. / Prasobhu, Pramod Kumar; Raveendran, Vivek; Buticchi, Giampaolo et al.
2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1146-1152 7930840 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC).

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

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N2 - Advanced packaging technologies in Wide band gap devices like GaN avoid wire bonds thereby making the solder joints more susceptible to thermo-mechanical fatigue. To limit the thermal cycling induced failures, an active thermal control scheme using a two step gate driver for a buck converter is presented in this paper. In contrast to the active thermal control techniques employing variation of switching frequency, this method does not alter the converter operation point. A simple temperature control algorithm which actively varies the device losses is proposed. The effectiveness of the control scheme has been validated through experimental results.

AB - Advanced packaging technologies in Wide band gap devices like GaN avoid wire bonds thereby making the solder joints more susceptible to thermo-mechanical fatigue. To limit the thermal cycling induced failures, an active thermal control scheme using a two step gate driver for a buck converter is presented in this paper. In contrast to the active thermal control techniques employing variation of switching frequency, this method does not alter the converter operation point. A simple temperature control algorithm which actively varies the device losses is proposed. The effectiveness of the control scheme has been validated through experimental results.

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M3 - Conference contribution

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T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

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PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017

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ER -

Prasobhu PK, Raveendran V, Buticchi G, Liserre M. Active thermal control of a DC/DC GaN-based converter. In 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1146-1152. 7930840. (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). doi: 10.1109/APEC.2017.7930840

Active thermal control of a DC/DC GaN-based converter

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