Tailoring of thermal transition temperature and toughening of shape memory epoxy polymer

Hua Deng, Junpeng Gao, Xuefeng An, Xiaosu Yi

Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

Shape memory epoxy polymer (SMEP-1) was modified by introducing flexible epoxy into existing resin system. The thermal transition temperature (Ttrans) of shape memory polymer was tailored from 100°C to 76°C with the increase of the weight fraction of the flexible epoxy. The toughness of the polymer was also measured at the same time. The results show that the toughness of the polymer was improved especially at ultralow temperature. The addition of the flexible epoxy didn't affect the excellent shape memory properties of the polymers.

Original languageEnglish
Title of host publicationApplied Mechanics and Mechatronics Automation
Pages93-98
Number of pages6
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event2012 International Applied Mechanics, Mechatronics Automation Symposium, IAMMAS 2012 - Shenyang, Liaoning, China
Duration: 7 Sep 20129 Sep 2012

Publication series

NameApplied Mechanics and Materials
Volume182-183
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Conference

Conference2012 International Applied Mechanics, Mechatronics Automation Symposium, IAMMAS 2012
Country/TerritoryChina
CityShenyang, Liaoning
Period7/09/129/09/12

Keywords

  • Shape memory epoxy polymer
  • Thermal transition temperature
  • Toughness

ASJC Scopus subject areas

  • Engineering (all)

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