Study on cure behavior of a model epoxy system by means of TTT diagram

Ming Zhang, Xue Feng An, Bang Ming Tang, Xiao Su Yi

Research output: Journal PublicationArticlepeer-review


Curing behavior of a model epoxies system (E-54/AG-80) with DDS as hardener was studied in this paper. Round disk compression mode DMA was executed to study the gel behaviors at different temperatures to determine the relationship between gel-time (tgel) and temperature. The cure kinetics was studied by dynamic DSC analysis. Parameters were obtained for establishing a phenomenological cure reaction model. The relationship between glass transition temperature (Tg) and cure degree (α) was also analyzed by both isothermal and dynamic DSC method based on DiBenedetto equation, which gave a mathematical description of Tg as a function of both time and temperature. Consequently, characteristic temperatures such as Tg0,gelTg and Tg∞ were determined. Finally, the Time-Temperature-Transition (TTT) diagram was designed based on the data and equations.

Original languageEnglish
Pages (from-to)57-62
Number of pages6
JournalCailiao Gongcheng/Journal of Materials Engineering
Issue number5
Publication statusPublished - May 2006
Externally publishedYes


  • Cure behavior
  • Epoxy resin
  • TTT diagram

ASJC Scopus subject areas

  • Aerospace Engineering


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