Review: Fine embossing of novel glasses for photonic integrated circuits

A. B. Seddon; D. Furniss; W. J. Pan; P. Sewell; A. Loni; Y. Zhang; T. M. Benson

doi:10.1109/ICTON.2007.4296204

Review: Fine embossing of novel glasses for photonic integrated circuits

A. B. Seddon, D. Furniss, W. J. Pan, P. Sewell, A. Loni, Y. Zhang, T. M. Benson

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

Abstract

Hot embossing of novel inorganic-compound glasses is a new fabrication technology for guided wave devices and circuitry. A patterned mould is pressed into the glass above its glass transition temperature (T₈) and replicated; cooling below T_g freezes-in the required pattern. The state-of-the-art is reviewed. Better than 0.1 μm-scale replication is shown for chaleogenide glasses and fabrication of a hot embossed monomode waveguide demonstrated.

Original language	English
Title of host publication	Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007
Pages	280-283
Number of pages	4
DOIs	https://doi.org/10.1109/ICTON.2007.4296204
Publication status	Published - 2007
Externally published	Yes
Event	2007 9th International Conference on Transparent Optical Networks, ICTON 2007 - Rome, Italy Duration: 1 Jul 2007 → 5 Jul 2007

Publication series

Name	Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007
Volume	2

Conference

Conference	2007 9th International Conference on Transparent Optical Networks, ICTON 2007
Country/Territory	Italy
City	Rome
Period	1/07/07 → 5/07/07

ASJC Scopus subject areas

Computer Networks and Communications
Electrical and Electronic Engineering
Communication

Access to Document

10.1109/ICTON.2007.4296204

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Seddon, A. B., Furniss, D., Pan, W. J., Sewell, P., Loni, A., Zhang, Y., & Benson, T. M. (2007). Review: Fine embossing of novel glasses for photonic integrated circuits. In Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007 (pp. 280-283). Article 4296204 (Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007; Vol. 2). https://doi.org/10.1109/ICTON.2007.4296204

@inproceedings{7e245738dcd04506a78f24046bcfca56,

title = "Review: Fine embossing of novel glasses for photonic integrated circuits",

abstract = "Hot embossing of novel inorganic-compound glasses is a new fabrication technology for guided wave devices and circuitry. A patterned mould is pressed into the glass above its glass transition temperature (T8) and replicated; cooling below Tg freezes-in the required pattern. The state-of-the-art is reviewed. Better than 0.1 μm-scale replication is shown for chaleogenide glasses and fabrication of a hot embossed monomode waveguide demonstrated.",

author = "Seddon, {A. B.} and D. Furniss and Pan, {W. J.} and P. Sewell and A. Loni and Y. Zhang and Benson, {T. M.}",

year = "2007",

doi = "10.1109/ICTON.2007.4296204",

language = "English",

isbn = "142441248X",

series = "Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007",

pages = "280--283",

booktitle = "Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007",

}

Seddon, AB, Furniss, D, Pan, WJ, Sewell, P, Loni, A, Zhang, Y & Benson, TM 2007, Review: Fine embossing of novel glasses for photonic integrated circuits. in Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007., 4296204, Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007, vol. 2, pp. 280-283, 2007 9th International Conference on Transparent Optical Networks, ICTON 2007, Rome, Italy, 1/07/07. https://doi.org/10.1109/ICTON.2007.4296204

Review: Fine embossing of novel glasses for photonic integrated circuits. / Seddon, A. B.; Furniss, D.; Pan, W. J. et al.
Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007. 2007. p. 280-283 4296204 (Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007; Vol. 2).

Research output: Chapter in Book/Conference proceeding › Conference contribution › peer-review

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T2 - 2007 9th International Conference on Transparent Optical Networks, ICTON 2007

AU - Seddon, A. B.

AU - Furniss, D.

AU - Pan, W. J.

AU - Sewell, P.

AU - Loni, A.

AU - Zhang, Y.

AU - Benson, T. M.

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AB - Hot embossing of novel inorganic-compound glasses is a new fabrication technology for guided wave devices and circuitry. A patterned mould is pressed into the glass above its glass transition temperature (T8) and replicated; cooling below Tg freezes-in the required pattern. The state-of-the-art is reviewed. Better than 0.1 μm-scale replication is shown for chaleogenide glasses and fabrication of a hot embossed monomode waveguide demonstrated.

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M3 - Conference contribution

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SN - 9781424412488

T3 - Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007

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BT - Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007

Y2 - 1 July 2007 through 5 July 2007

ER -

Seddon AB, Furniss D, Pan WJ, Sewell P, Loni A, Zhang Y et al. Review: Fine embossing of novel glasses for photonic integrated circuits. In Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007. 2007. p. 280-283. 4296204. (Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007). doi: 10.1109/ICTON.2007.4296204

Review: Fine embossing of novel glasses for photonic integrated circuits

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