Review: Fine embossing of novel glasses for photonic integrated circuits

A. B. Seddon, D. Furniss, W. J. Pan, P. Sewell, A. Loni, Y. Zhang, T. M. Benson

Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

Hot embossing of novel inorganic-compound glasses is a new fabrication technology for guided wave devices and circuitry. A patterned mould is pressed into the glass above its glass transition temperature (Tg) and replicated; cooling below Tg freezes-in the required pattern. The state-of-the-art is reviewed. Better than 0.1 μm -scale replication is shown for chalcogenide glasses and fabrication of a hot embossed monomode waveguide demonstrated.

Original languageEnglish
Title of host publicationOptical Components and Materials V
DOIs
Publication statusPublished - 2008
Externally publishedYes
EventOptical Components and Materials V - San Jose, CA, United States
Duration: 21 Jan 200823 Jan 2008

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6890
ISSN (Print)0277-786X

Conference

ConferenceOptical Components and Materials V
Country/TerritoryUnited States
CitySan Jose, CA
Period21/01/0823/01/08

Keywords

  • Chalcogenide glasses
  • Embossing
  • Monomode waveguide
  • Moulding
  • Planar waveguides
  • Rib waveguide

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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