Junction Temperature Control for More Reliable Power Electronics

Markus Andresen, Ke Ma, Giampaolo Buticchi, Johannes Falck, Frede Blaabjerg, Marco Liserre

Research output: Journal PublicationArticlepeer-review

170 Citations (Scopus)

Abstract

The thermal stress of power electronic components is one of the most important causes of their failure. Proper thermal management plays an important role for more reliable and cost-effective energy conversion. As one of the most vulnerable and expensive components, power semiconductor components are the focus of this paper. Possible approaches to control the semiconductor junction temperature are discussed in this paper, along with the implementation in several emerging applications. The modification of the control variables at different levels (modulation, control, and system) to alter the loss generation or distribution is analyzed. Some of the control solutions presented in the literature, which showed experimentally that the thermal stress can be effectively reduced, are reviewed in detail. These results are often mission-profile dependent and the controller needs to be tuned to reach the desired cost-benefit tradeoff. This paper analyzes also the many open questions of this research area. Among them, it is worth highlighting that a verification of the actual lifetime extension is still missing.

Original languageEnglish
Article number7892031
Pages (from-to)765-776
Number of pages12
JournalIEEE Transactions on Power Electronics
Volume33
Issue number1
DOIs
Publication statusPublished - Jan 2018
Externally publishedYes

Keywords

  • Temperature control
  • Thermal management of Electronics
  • pulse width modulation inverters

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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