Highly Ordered BN–BN Stacking Structure for Improved Thermally Conductive Polymer Composites

Barun Ghosh, Fang Xu, David M. Grant, Paolo Giangrande, Chris Gerada, Michael W. George, Xianghui Hou

Research output: Journal PublicationArticlepeer-review

8 Citations (Scopus)
2 Downloads (Pure)

Abstract

The substantial heat generation in modern electronic devices is one of the major issues requiring efficient thermal management. This work demonstrates a novel concept for the design of thermally conducting networks inside a polymer matrix for the development of highly thermally conductive composites. Highly ordered hexagonal boron nitride (hBN) structures are obtained utilizing a freeze-casting method. These structures are then thermally sintered to get a continuous network of BN–BN of high thermal conductivity in which a polymer matrix can be impregnated, enabling a directional and thermally conducting composite. The highest achieved thermal conductivity (K) is 4.38 W m−1 K−1 with a BN loading of 32 vol%. The effect of sintering temperatures on the K of the composite is investigated to optimize connectivity and thermal pathways while maintaining an open structure (porosity ≈ 2.7%). The composites also maintain good electrical insulation (volume resistivity ≈ 1014 Ω cm). This new approach of thermally sintering BN–BN aligned structures opens up a new avenue for the design and preparation of filler alignment in polymer-based composites for improving the thermal conductivity while maintaining high electrical resistance, which is a topic of interest in electronic packaging and power electronics applications.

Original languageEnglish
Article number2000627
JournalAdvanced Electronic Materials
Volume6
Issue number11
DOIs
Publication statusPublished - Nov 2020

Keywords

  • filler alignments
  • hexagonal boron nitride
  • high-temperature sintering
  • polymer composites
  • thermal conductivity

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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