Biphenyl polyimide composite endcapped with phenylethynyl

Zhen Wang, Huili Yang, Xiaosu Yi, Mengxian Ding

Research output: Journal PublicationArticlepeer-review

8 Citations (Scopus)


High temperature biphenyl polyimide resin endcapped with phenylethynyl was prepared using the modified polymerization monomeric reactants method (MPMR). The polyimide composite was fabricated by press molding, and the processing technique was discussed also. The polyimide composite shows high thermal stability at 371°C. The mechanical properties of the composite at 371°C can maintain as much as 50% of mechanical properties at room temperature. The glass transition temperature of the polyimide composite is 449°C. The mass loss at 371°C in air is less than 3% over 100h at 371°C. The obtained polyimide composite achieves the basic demands of the high temperature resin at 371°C.

Original languageEnglish
Pages (from-to)1-4
Number of pages4
JournalFuhe Cailiao Xuebao/Acta Materiae Compositae Sinica
Issue number3
Publication statusPublished - Jun 2006
Externally publishedYes


  • Composites
  • Mechanical properties
  • Phenylethynyl
  • Polyimide
  • Thermal properties

ASJC Scopus subject areas

  • Ceramics and Composites
  • Chemistry (all)
  • Condensed Matter Physics
  • Mechanics of Materials


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