Analytical modeling of ground surface topography in monocrystalline silicon grinding considering the ductile-regime effect

Hao Nan Li, Tian Biao Yu, Li Da Zhu, Wan Shan Wang

Research output: Journal PublicationArticlepeer-review

38 Citations (Scopus)

Abstract

Grinding process of monocrystalline silicon easily leads to fractured surfaces, therefore an analytical model of the ground silicon surface is presented. In the model, the ductile-regime effect is considered by determining grain-workpiece interaction mode (ductile and brittle modes) at each grinding moment. Validation experiments proved that the model can, to a large extent, describe realistic silicon grinding and predict the machined surfaces in terms of (i) brittle and ductile area, (ii) roughness and waviness, and (iii) potential chipping zone sizes. The model therefore is anticipated to be not only meaningful to guide and optimize the industrial silicon grinding process, but also transferable to other kinds of brittle materials.

Original languageEnglish
Pages (from-to)880-893
Number of pages14
JournalArchives of Civil and Mechanical Engineering
Volume17
Issue number4
DOIs
Publication statusPublished - 1 Sep 2017
Externally publishedYes

Keywords

  • Analytical model
  • Grinding
  • Silicon
  • Surface topography

ASJC Scopus subject areas

  • Civil and Structural Engineering
  • Mechanical Engineering

Fingerprint

Dive into the research topics of 'Analytical modeling of ground surface topography in monocrystalline silicon grinding considering the ductile-regime effect'. Together they form a unique fingerprint.

Cite this