Active thermal control of a DC/DC GaN-based converter

Pramod Kumar Prasobhu, Vivek Raveendran, Giampaolo Buticchi, Marco Liserre

Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

7 Citations (Scopus)

Abstract

Advanced packaging technologies in Wide band gap devices like GaN avoid wire bonds thereby making the solder joints more susceptible to thermo-mechanical fatigue. To limit the thermal cycling induced failures, an active thermal control scheme using a two step gate driver for a buck converter is presented in this paper. In contrast to the active thermal control techniques employing variation of switching frequency, this method does not alter the converter operation point. A simple temperature control algorithm which actively varies the device losses is proposed. The effectiveness of the control scheme has been validated through experimental results.

Original languageEnglish
Title of host publication2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1146-1152
Number of pages7
ISBN (Electronic)9781509053667
DOIs
Publication statusPublished - 17 May 2017
Externally publishedYes
Event32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 - Tampa, United States
Duration: 26 Mar 201730 Mar 2017

Publication series

NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Conference

Conference32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017
Country/TerritoryUnited States
CityTampa
Period26/03/1730/03/17

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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