A Flexible and Ultra-Highly Sensitive Tactile Sensor through a Parallel Circuit by a Magnetic Aligned Conductive Composite

Yang Jiang, Fei Liang, Hua Yang Li, Xin Li, You Jun Fan, Jin Wei Cao, Yiming Yin, Ying Wang, Zhong Lin Wang, Guang Zhu

Research output: Journal PublicationArticlepeer-review

33 Citations (Scopus)

Abstract

The development of flexible electronic skins with high performance and multifunctional sensing capabilities is of great significance for applications ranging from healthcare monitoring to artificial intelligence. To mimic and surpass the high-gauge-factor sensing properties of human skin, structure design and appropriate material selection of sensors are both essentially required. Here, we present an efficient, low-cost fabrication strategy to construct an ultra-highly sensitive, flexible pressure sensor by embedding the aligned nickel-coated carbon fibers (NICFs) in a polydimethylsiloxane (PDMS) substrate. Our design substantially contributes to ultrahigh sensitivity through the parallel circuit formed by aligned NICFs as well as surface spinosum microstructure molded by sandpaper. As a result, the sensor exhibits excellent sensitivity (15â »525 kPa-1), a fast response time (30 ms), and good stability over 3000 loading-unloading cycles. Furthermore, these superior sensing properties trigger applications in water quality and wave monitoring in conjunction with mechanical flexibility and robustness. As a precedent for adjusting the sensitivities of the sensor, the NICFs/PDMS sensor provides a promising method for multiscenario healthcare monitoring, multiscale pressure spatial distribution, and human-machine interfacing.

Original languageEnglish
Pages (from-to)746-754
Number of pages9
JournalACS Nano
Volume16
Issue number1
Early online date5 Jan 2022
DOIs
Publication statusPublished - 25 Jan 2022

Keywords

  • aligned fibers
  • flexible electronics
  • high sensitivity
  • magnetic orientation
  • piezoresistance sensor
  • tactile sensor

ASJC Scopus subject areas

  • General Materials Science
  • General Engineering
  • General Physics and Astronomy

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