Additive fabrication of 3D printed electronics based on a commercial DLP machine

Abstract

This research establishes a cost-effective methodology for fabricating functional three-dimensional electronics using consumer-grade DLP 3D printing and photopolymer resins, achieving over 95% cost reduction compared to industrial direct ink writing systems. Systematic optimization of printing parameters (0.5mm layer thickness, 3.5 s/layer exposure) and channel design principles enabled development of a standardized workflow for creating embedded conductive networks. Silver paste injection protocols combined with post-processing, including ultrasonic resin removal and 180°C sintering, yielded circuits demonstrating less than 5% resistance deviation from theoretical models.
A functional wireless module integrating Bluetooth communication, power management, and LED indicators validated the approach, exhibiting stable 10-meter connectivity. Critical innovations include curved-channel optimization mitigating particle sedimentation and a multi-stage cleaning protocol achieving >99.7% uncured resin removal.
Current limitations in feature resolution and manual paste injection dependence highlight requirements for multi-material DLP systems and UV-curable conductive resins. The absence of dedicated 3D circuit design tools further necessitates development of topology-optimized design software. This work demonstrates consumer DLP printing's viability for rapid 3D electronics prototyping, showing transformative potential for conformal aerospace sensors and structural IoT devices. Future advancement requires co-development of hybrid manufacturing systems, application-specific materials, and standardized design frameworks.

Date of Award	15 Jul 2026
Original language	English
Awarding Institution	University of Nottingham
Supervisor	Haonan Li (Supervisor), Yinfeng He (Supervisor), Shun Bai (Supervisor) & Gongyu Liu (Supervisor)