Keyphrases
Room Temperature
100%
Temperature Effect
100%
Material Removal Mechanism
100%
Micron-scale
100%
Nano-submicron
100%
Soft-brittle Crystal
100%
Elevated Temperature
75%
Crack Propagation
50%
Cutting Mechanism
50%
Depth of Cut
25%
Ductile Regime
25%
Dislocation
25%
Grit
25%
High Capacity
25%
Plastic Deformation
25%
Fracture Toughness
25%
Difficult-to-cut Materials
25%
Machinability
25%
Crystal Lattice
25%
Machining Process
25%
In Situ TEM
25%
Brittle-ductile Transition
25%
Difficult-to-cut
25%
Ductile Mode Cutting
25%
Elastic Modulus
25%
Material Removal Rate
25%
Ammonium Phosphate
25%
Soft Brittle Material
25%
Crack Edge
25%
Nanoscratch
25%
Superplasticity
25%
Thermal Assist
25%
KDP Crystal
25%
Crack Interaction
25%
Edge chipping
25%
Nanocrystals
25%
Surface Microstructure
25%
Ultra-precision Machining
25%
Brittle Scratches
25%
Brittleness
25%
Engineering
Room Temperature
100%
Material Removal Mechanism
100%
Elevated Temperature
75%
Crack Propagation
50%
Subsurface
50%
Material Removal Rate
25%
Brittle Material
25%
Impact Toughness
25%
Nanoscale
25%
Plastic Deformation
25%
Cut Material
25%
Microstructure
25%
Cutting Depth
25%
Young's Modulus
25%
Conventional Method
25%
Nanocrystal
25%
Brittleness
25%
Great Number
25%
Material Science
Machining
100%
Crack Propagation
100%
Brittleness
100%
Fracture Toughness
50%
Crystal Structure
50%
Machinability
50%
Nanocrystalline Material
50%
Elastic Moduli
50%
Plastic Deformation
50%
Nucleation
50%
Ductile-to-Brittle Transition
50%