Abstract
Active thermal control for power modules can potentially extend the lifetime of the converter. This paper investigates the trade-off between the lifetime extension or de-rating and its cost due to the efficiency reduction. A short review on the existing approaches using control to reduce thermal stress of power modules is presented. Based on a given junction temperature profile, a method to evaluate the active thermal control's trade-off is presented. The concept is validated on a laboratory setup, where active thermal control is implemented by adapting the switching frequency. A discussion of the possible lifetime extension at the efficiency's expense is finally given.
| Original language | English |
|---|---|
| Pages (from-to) | 119-125 |
| Number of pages | 7 |
| Journal | Microelectronics Reliability |
| Volume | 58 |
| DOIs | |
| Publication status | Published - 1 Mar 2016 |
| Externally published | Yes |
Keywords
- Reliability
- Thermal control
- Thermal cycling
- Thermal management
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Safety, Risk, Reliability and Quality
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering