Self-healing of cracks during ductile regime machining of silicon: Insights from molecular dynamics simulation

Keyphrases

• Ductile Machining 100%
• Crack Healing 100%
• Ductile-regime Cutting 33%
• Long-range Potentials 33%
• Machining Stress 33%
• Nanogrooves 33%
• β-tin 33%
• Brittle Crack 33%
• Direct Imaging 33%

Engineering

• Computer Simulation 100%
• Cutting Temperature 50%
• Cut Surface 50%
• Potential Function 50%
• Microfracture 50%
• X-Ray Diffraction Analysis 50%

Material Science

• Machining 100%
• Silicon 100%
• Tin 20%
• Nanoindentation 20%
• X Ray Diffraction Analysis 20%
• Amorphization 20%