Abstract
A new polyimide composite was developed relying on the concept of in situ polymerization of monomer reactants polyimide. High thermal conductive, low dielectric constant and dielectric loss, and thermal-stable composites were successfully demonstrated by incorporating aluminum nitride powder into the polyimide. The weight percent of aluminum nitride was up to 80%. The thermal and dielectric properties follow the classic composite theories.
| Original language | English |
|---|---|
| Pages (from-to) | 3913-3917 |
| Number of pages | 5 |
| Journal | Journal of Applied Polymer Science |
| Volume | 89 |
| Issue number | 14 |
| DOIs | |
| Publication status | Published - 17 Jul 2003 |
| Externally published | Yes |
Keywords
- Aluminum nitride
- Dielectric properties
- Polymerization of monomer reactant type polyimide
- Thermal conductivity
ASJC Scopus subject areas
- General Chemistry
- Surfaces, Coatings and Films
- Polymers and Plastics
- Materials Chemistry