Microscopic stress analysis of nanoscratch induced sub-surface defects in a single-crystal silicon wafer

Material Science

• Stress Analysis 100%
• Single Crystal 100%
• Silicon Wafer 100%
• Surface Defect 100%
• Silicon 66%
• Machining 33%
• Nanoindentation 16%
• Silicon Carbide 16%
• Indentation 16%

Keyphrases

• Microscopic Stress 100%
• Subsurface Defects 100%
• Dislocation Propagation 16%
• Plastic Zone 16%
• Inelastic Deformation 16%
• Stress-based Criterion 16%
• Defect Model 16%
• Novel Criterion 16%
• Mode Experiment 16%
• Single Crystal Materials 16%
• Microscopic Characterization 16%
• Dislocation multiplication 16%
• Elastic Crack 16%
• Defect Characteristics 16%
• Defect Prediction 16%
• Elastic Zone 16%
• Efficient Machining 16%

Engineering

• Nanomanufacturing System 16%