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Direct Ink Writing of High Mechanical Performance Vinyl Ester-Fumed Silica Nanocomposites with Ultraviolet-Thermal Dual Curing

Research output: Chapter in Book/Conference proceedingConference contributionpeer-review

Abstract

Vinyl ester (VE) is a widely used thermosetting polymer as structural materials because of its high mechanical properties and excellent chemical resistance. In this work, a modified setup of direct ink writing (DIW) with ultraviolet (UV)-thermal dual curing is developed to fabricate nanocomposites consist of commercially available VE resins and 4 wt% fumed silica (FS) with excellent mechanical performance. The printing ink extruded is within a dark zone that allows for liquid merging before exposed in UV light for rapid solidification, thus improving the interfacial bonding between infill paths. A subsequent thermal curing stage is then applied to induce a high degree of crosslinking. The printed and dual cured VE/FS nanocomposites have a Young’s modulus of 3.7 GPa and a tensile strength of approximately 80 MPa, which outperforms conventionally molded neat VE and also indistinguishable from the tensile properties of molded VE/FS nanocomposites. Along with the outstanding mechanical properties, the scalability and resolution of this DIW technique with dual curing is demonstrated by printing multiple three-dimensional structures.

Original languageEnglish
Title of host publicationAIAA SciTech Forum 2022
PublisherAmerican Institute of Aeronautics and Astronautics Inc, AIAA
ISBN (Print)9781624106316
DOIs
Publication statusPublished - 2022
Externally publishedYes
EventAIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2022 - San Diego, United States
Duration: 3 Jan 20227 Jan 2022

Publication series

NameAIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2022

Conference

ConferenceAIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2022
Country/TerritoryUnited States
CitySan Diego
Period3/01/227/01/22

ASJC Scopus subject areas

  • Aerospace Engineering

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