TY - GEN
T1 - Direct Ink Writing of High Mechanical Performance Vinyl Ester-Fumed Silica Nanocomposites with Ultraviolet-Thermal Dual Curing
AU - Tu, Ruowen
AU - Sodano, Henry A.
N1 - Publisher Copyright:
© 2022, American Institute of Aeronautics and Astronautics Inc, AIAA. All rights reserved.
PY - 2022
Y1 - 2022
N2 - Vinyl ester (VE) is a widely used thermosetting polymer as structural materials because of its high mechanical properties and excellent chemical resistance. In this work, a modified setup of direct ink writing (DIW) with ultraviolet (UV)-thermal dual curing is developed to fabricate nanocomposites consist of commercially available VE resins and 4 wt% fumed silica (FS) with excellent mechanical performance. The printing ink extruded is within a dark zone that allows for liquid merging before exposed in UV light for rapid solidification, thus improving the interfacial bonding between infill paths. A subsequent thermal curing stage is then applied to induce a high degree of crosslinking. The printed and dual cured VE/FS nanocomposites have a Young’s modulus of 3.7 GPa and a tensile strength of approximately 80 MPa, which outperforms conventionally molded neat VE and also indistinguishable from the tensile properties of molded VE/FS nanocomposites. Along with the outstanding mechanical properties, the scalability and resolution of this DIW technique with dual curing is demonstrated by printing multiple three-dimensional structures.
AB - Vinyl ester (VE) is a widely used thermosetting polymer as structural materials because of its high mechanical properties and excellent chemical resistance. In this work, a modified setup of direct ink writing (DIW) with ultraviolet (UV)-thermal dual curing is developed to fabricate nanocomposites consist of commercially available VE resins and 4 wt% fumed silica (FS) with excellent mechanical performance. The printing ink extruded is within a dark zone that allows for liquid merging before exposed in UV light for rapid solidification, thus improving the interfacial bonding between infill paths. A subsequent thermal curing stage is then applied to induce a high degree of crosslinking. The printed and dual cured VE/FS nanocomposites have a Young’s modulus of 3.7 GPa and a tensile strength of approximately 80 MPa, which outperforms conventionally molded neat VE and also indistinguishable from the tensile properties of molded VE/FS nanocomposites. Along with the outstanding mechanical properties, the scalability and resolution of this DIW technique with dual curing is demonstrated by printing multiple three-dimensional structures.
UR - https://www.scopus.com/pages/publications/85122735111
U2 - 10.2514/6.2022-0077
DO - 10.2514/6.2022-0077
M3 - Conference contribution
AN - SCOPUS:85122735111
SN - 9781624106316
T3 - AIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2022
BT - AIAA SciTech Forum 2022
PB - American Institute of Aeronautics and Astronautics Inc, AIAA
T2 - AIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2022
Y2 - 3 January 2022 through 7 January 2022
ER -