Keyphrases
Dielectric Breakdown
100%
Direct Current
100%
Pulsed Direct-current Magnetron Sputtering
100%
Alumina Thin Films
100%
Time-dependent Dielectric Breakdown
50%
CuAl
50%
Crystallites
25%
Scratch Test
25%
Adhesion
25%
Interfacial Layer
25%
Pullout
25%
Conductive Atomic Force Microscopy (C-AFM)
25%
Dielectric Strength
25%
Film Quality
25%
Reactive Alumina
25%
Metallic Clusters
25%
Conduction Mechanism
25%
Amorphous Matrix
25%
Alumina Film
25%
Magnetron Sputtering Deposition
25%
Sputtered Films
25%
Nanocrystallites
25%
Buckling Failure
25%
Current Leakage
25%
Pulsed DC
25%
High Applied Field
25%
Deposition Power
25%
Al Interlayer
25%
Fowler-Nordheim Tunneling
25%
DC Sputtering
25%
Pre-breakdown
25%
Engineering
Aluminum Oxide
100%
Dielectrics
100%
Thin Films
100%
Direct Current
100%
Magnetron
100%
Crystallite
33%
Defects
16%
Buckling
16%
Interlayer
16%
Tensiles
16%
Interfacial Layer
16%
Film Quality
16%
Conductive Atomic Force Microscopy
16%
Applied Field
16%
Dielectric Strength
16%
Fowler-Nordheim Tunneling
16%
Amorphous Matrix
16%
Material Science
Aluminum Oxide
100%
Thin Films
100%
Magnetron Sputtering
100%
Electrical Breakdown
100%
Film
75%
Crystallite
50%
Aluminum
25%
Dielectric Material
25%
Mechanical Strength
25%
Amorphous Material
25%
Sputtered Film
25%
Scratch Testing
25%