Abstract
In this paper, a novel method named "surface defect machining" (SDM) which was previously applied to hard turning (HT) processes [1] has been applied to nanometric cutting. Using state-of-the-art tools of molecular dynamics simulation and single point diamond turning (SPDT) experiment, it has been shown that a well controlled SDM process can aid to bridge the gap of turning and polishing processes with respect to attainable machined surface roughness and reduced sub-surface damage.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 |
| Editors | R. Leach, Paul Shore |
| Publisher | euspen |
| Pages | 348-351 |
| Number of pages | 4 |
| Volume | 2 |
| ISBN (Electronic) | 9780956679024 |
| Publication status | Published - 2013 |
| Externally published | Yes |
| Event | 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 - Berlin, Germany Duration: 27 May 2013 → 31 May 2013 |
Conference
| Conference | 13th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2013 |
|---|---|
| Country/Territory | Germany |
| City | Berlin |
| Period | 27/05/13 → 31/05/13 |
ASJC Scopus subject areas
- Mechanical Engineering
- General Materials Science
- Environmental Engineering
- Industrial and Manufacturing Engineering
- Instrumentation