Abstract
The cure kinetics of a bicomponent high performance epoxy resin was studied by dynamic DSC analysis, and the parameters of the cure reaction were obtained to establish a phenomenological model. The relationship between glass transition temperature (Tg) and cure degree (α) was analyzed with an isothermal plus dynamic DSC method based on DiBenedetto equation, and a mathematical description of Tg as a function of both time arid temperature was suggested. Round disk compression mode DMA was employed to study the gelation at different temperatures, and the relationship between gel-time and temperature was obtained. The conversion at gelation turned out to be αgel=0.4539, while the temperature at which vitrification line and gelation line transected was found to be Tg, gel=70.18°C. The time-temperature-transition (TTT) diagram was plotted based on the works above, which served as a tool for process optimization in advanced composites manufacture.
| Original language | English |
|---|---|
| Pages (from-to) | 17-25 |
| Number of pages | 9 |
| Journal | Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica |
| Volume | 23 |
| Issue number | 1 |
| Publication status | Published - Feb 2006 |
| Externally published | Yes |
Free Keywords
- Cure kinetic
- Epoxy resin
- Gelation
- TTT diagram
ASJC Scopus subject areas
- Ceramics and Composites
- General Chemistry
- Condensed Matter Physics
- Mechanics of Materials