TY - GEN
T1 - An Efficient Statistical Clock Skew Analysis Method for Clock Trees
AU - Cui, Ziyin
AU - Zhang, Tao
AU - Cai, Yihui
AU - Cao, Peng
AU - Lin, Ting Jung
AU - He, Lei
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Increasing process variability poses great challenge in 2D/3D high-performance clock network design. The variation of device, interconnect and TSV lead to the clock skew variation. However, in most prior models, the variation was not considered comprehensively, where the effect of the equivalent capacitance variation of the interconnect/TSV on the delay of the device was ignored, leading to poor accuracy for clock tree delay variation. In this work, an efficient statistical clock skew analysis method for clock trees is proposed, which considers the variations of device, interconnect, and TSV in 2D/3D clock trees together, and considers the cap variation impact on device variation during the bottom up propagation algorithm. The proposed model was validated under TSMC 22nm process by 3D clock trees implemented for artificial H-tree constructed cases and ISCAS'89 benchmarks. Our model demonstrates excellent agreement with golden Monte Carlo simulation results in terms of the standard deviation of maximum clock skew with the average error of 2.47% while achieves 1400 times speed up. Comparing with competitive works, our model achieves 1.9 times accuracy improvement with comparative simulation effort.
AB - Increasing process variability poses great challenge in 2D/3D high-performance clock network design. The variation of device, interconnect and TSV lead to the clock skew variation. However, in most prior models, the variation was not considered comprehensively, where the effect of the equivalent capacitance variation of the interconnect/TSV on the delay of the device was ignored, leading to poor accuracy for clock tree delay variation. In this work, an efficient statistical clock skew analysis method for clock trees is proposed, which considers the variations of device, interconnect, and TSV in 2D/3D clock trees together, and considers the cap variation impact on device variation during the bottom up propagation algorithm. The proposed model was validated under TSMC 22nm process by 3D clock trees implemented for artificial H-tree constructed cases and ISCAS'89 benchmarks. Our model demonstrates excellent agreement with golden Monte Carlo simulation results in terms of the standard deviation of maximum clock skew with the average error of 2.47% while achieves 1400 times speed up. Comparing with competitive works, our model achieves 1.9 times accuracy improvement with comparative simulation effort.
KW - 2D/3D timing model
KW - clock skew
KW - process parameter variation
UR - https://www.scopus.com/pages/publications/85201735477
U2 - 10.1109/ISEDA62518.2024.10617702
DO - 10.1109/ISEDA62518.2024.10617702
M3 - Conference contribution
AN - SCOPUS:85201735477
T3 - 2024 International Symposium of Electronics Design Automation, ISEDA 2024
SP - 416
EP - 420
BT - 2024 International Symposium of Electronics Design Automation, ISEDA 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 International Symposium of Electronics Design Automation, ISEDA 2024
Y2 - 10 May 2024 through 13 May 2024
ER -