An analytical model to predict the depth of sub-surface damage for grinding of brittle materials

Keyphrases

• Analytical Model 100%
• Brittle Materials 100%
• Subsurface Damage 100%
• Depth of Cut 33%
• Hard Materials 33%
• Grinding Speed 33%
• Crack Propagation 33%
• Production Efficiency 33%
• Crack Initiation 33%
• Damage Depth 33%
• Grinding Experiment 33%
• Strain Rate Effect 33%
• Silicon Wafer 33%
• Brittleness 33%
• Fracture Mechanics 33%
• High Strain Rate 33%
• Grinding Parameters 33%
• Phase Change Properties 33%
• Metastable Phases 33%
• Crack Fracture 33%
• Dislocation Kinetics 33%

Engineering

• Grinding (Machining) 100%
• Brittle Material 100%
• Analytical Model 100%
• Subsurface 100%
• Experimental Result 20%
• Crack Propagation 20%
• Strain Rate 20%
• Crack Initiation 20%
• Effect of Strain 20%
• Silicon Wafer 20%
• Brittleness 20%
• Fracture Mechanics 20%
• High Strain Rate 20%
• Metastable Phase 20%

Material Science

• Surface Damage 100%
• Brittleness 100%
• Strain Rate 66%
• Crack Initiation 33%
• Crack Propagation 33%
• Effect of Strain 33%
• Silicon Wafer 33%
• Fracture Mechanics 33%